Renesas Electronics America Inc UPD70F3825GB-GAH-AX

UPD70F3825GB-GAH-AX


  • Manufacturer: Renesas Electronics America Inc
  • CONEVO NO: UPD70F3825GB-GAH-AX
  • Package: 64-LQFP
  • Datasheet: PDF
  • Stock: In stock
  • Description: UPD70F3825GB-GAH-AX(Kg)

Details

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Parameters
Mfr Renesas Electronics America Inc
Series V850ES/Jx3-H
Package Tray
Product Status Not For New Designs
Core Processor V850ES
Core Size 32-Bit Single-Core
Speed 48MHz
Connectivity CANbus, CSI, EBI/EMI, I²C, UART/USART, USB
Peripherals DMA, LVD, PWM, WDT
Number of I/O 45
Program Memory Size 256KB (256K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 24K x 8
Voltage - Supply (Vcc/Vdd) 2.85V ~ 3.6V
Data Converters A/D 10x10b; D/A 1x8b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 64-LQFP
Base Product Number UPD70F3825
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 160
V850ES V850ES/Jx3-H Microcontroller IC 32-Bit Single-Core 48MHz 256KB (256K x 8) FLASH
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