Rohm Semiconductor BD87554YFV-CE2

BD87554YFV-CE2


  • Manufacturer: Rohm Semiconductor
  • CONEVO NO: BD87554YFV-CE2
  • Package: 14-LSSOP (0.173", 4.40mm Width)
  • Datasheet: PDF
  • Stock: In stock
  • Description: BD87554YFV-CE2(Kg)

Details

Tags

Parameters
Mfr Rohm Semiconductor
Series EMARMOUR™
Package Tape & Reel (TR)
Product Status Active
Amplifier Type CMOS
Number of Circuits 4
Output Type Push-Pull, Rail-to-Rail
Slew Rate 2.4V/µs
Current - Input Bias 1 pA
Voltage - Input Offset 1 mV
Current - Supply 7.9mA
Current - Output / Channel 16.5 mA
Voltage - Supply Span (Min) 4 V
Voltage - Supply Span (Max) 15 V
Operating Temperature -40°C ~ 125°C
Mounting Type Surface Mount
Package / Case 14-LSSOP (0.173", 4.40mm Width)
Supplier Device Package 14-SSOPB
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8542.33.0001
Standard Package 2,500
CMOS Amplifier 4 Circuit Push-Pull, Rail-to-Rail 14-SSOPB
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