Rohm Semiconductor BR25H010FJ-2CE2

BR25H010FJ-2CE2


  • Manufacturer: Rohm Semiconductor
  • CONEVO NO: BR25H010FJ-2CE2
  • Package: 8-SOIC (0.154", 3.90mm Width)
  • Datasheet: PDF
  • Stock: In stock
  • Description: BR25H010FJ-2CE2(Kg)

Details

Tags

Parameters
Mfr Rohm Semiconductor
Series Automotive, AEC-Q100
Package Tape & Reel (TR)
Product Status Active
Memory Type Non-Volatile
Memory Format EEPROM
Technology EEPROM
Memory Size 1Kbit
Memory Organization 128 x 8
Memory Interface SPI
Clock Frequency 10 MHz
Write Cycle Time - Word, Page 4ms
Voltage - Supply 2.5V ~ 5.5V
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package 8-SOP-J
Base Product Number BR25H010
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0051
Standard Package 2,500
EEPROM Memory IC 1Kbit SPI 10 MHz 8-SOP-J
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