Rohm Semiconductor BR25H1MFJ-5ACE2

BR25H1MFJ-5ACE2


  • Manufacturer: Rohm Semiconductor
  • CONEVO NO: BR25H1MFJ-5ACE2
  • Package: 8-SOIC (0.154", 3.90mm Width)
  • Datasheet: PDF
  • Stock: In stock
  • Description: BR25H1MFJ-5ACE2(Kg)

Details

Tags

Parameters
Mfr Rohm Semiconductor
Series Automotive, AEC-Q100
Package Tape & Reel (TR)
Product Status Active
Memory Type Non-Volatile
Memory Format EEPROM
Technology EEPROM
Memory Size 1Mbit
Memory Organization 128K x 8
Memory Interface SPI
Clock Frequency 20 MHz
Write Cycle Time - Word, Page 3.5ms
Voltage - Supply 1.7V ~ 5.5V
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package 8-SOP-J
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
Standard Package 2,500
EEPROM Memory IC 1Mbit SPI 20 MHz 8-SOP-J
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