Parameters | |
---|---|
Series | - |
RoHS Status | ROHS3 Compliant |
Mfr | Samsung Semiconductor, Inc. |
Package | Tray |
Product Status | Active |
Other Names | 3277-K4F6E3S4HM-MGCJ |
Standard Package | 1,280 |
Samsung Semiconductor K4F6E3S4HM-MGCJ Memory IC Overview
The Samsung K4F6E3S4HM-MGCJ is a high-performance DDR4 SDRAM memory chip designed for data-intensive applications. This component features a 4Gb (512M x 8) density, operates at a voltage range of 1.14V to 1.26V, and supports a data transfer rate of up to 3200 Mbps. Built on advanced 10nm-class process technology, it utilizes a 78-ball FBGA package optimized for space-constrained designs. The SDRAM memory chip operates within a temperature range of -25°C to +85°C, ensuring reliability across industrial and commercial environments.
Key Features
This IC integrates low-power DDR4 architecture with auto-refresh and self-refresh modes to minimize energy consumption. Its dual-channel configuration enables high-bandwidth data throughput, while on-die termination (ODT) reduces signal reflection for improved signal integrity. The chip supports error correction code (ECC) for enhanced data accuracy and features programmable burst lengths (BL8/BC4/OTF) for flexible system integration. Robust thermal management ensures stable operation under extended workloads.
Application Scenarios
The K4F6E3S4HM-MGCJ is ideal for high-speed computing systems, including enterprise servers, data center storage arrays, and AI/ML acceleration hardware. It is widely deployed in 5G network infrastructure, automotive ADAS modules, and industrial automation controllers requiring low-latency memory access. Additionally, its compact form factor suits consumer electronics such as ultra-thin laptops, gaming consoles, and IoT edge devices.
Selection Advantages
Samsung's K4F6E3S4HM-MGCJ outperforms competitors with its industry-leading power efficiency (30% lower active power vs. previous-gen DDR3). Rigorous quality testing guarantees compliance with JEDEC standards and extended lifecycle support for industrial deployments. Its backward compatibility with DDR4-2400/2666 systems simplifies upgrades, while Samsung's global supply chain ensures scalable procurement. Engineers benefit from detailed technical documentation and dedicated firmware optimization tools to accelerate time-to-market.