Silicon Motion, Inc. SM662PXB BESS

SM662PXB BESS


  • Manufacturer: Silicon Motion, Inc.
  • CONEVO NO: SM662PXB BESS
  • Package: 153-TBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: SM662PXB BESS(Kg)

Details

Tags

Parameters
Mfr Silicon Motion, Inc.
Series Ferri-eMMC®
Package Tray
Product Status Active
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND (TLC)
Memory Size -
Memory Interface eMMC
Write Cycle Time - Word, Page -
Voltage - Supply -
Operating Temperature -
Mounting Type Surface Mount
Package / Case 153-TBGA
Supplier Device Package 153-BGA (11.5x13)
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B1A
HTSUS 8542.32.0071
Other Names 1984-SM662PXBBESS
Standard Package 1,520
FLASH - NAND (TLC) Memory IC eMMC 153-BGA (11.5x13)
Contact Information
close