Texas Instruments BBN6203BGNY30C

BBN6203BGNY30C


  • Manufacturer: Texas Instruments
  • CONEVO NO: BBN6203BGNY30C
  • Package: 384-FBGA, FCCSPBGA
  • Datasheet: -
  • Stock: In stock
  • Description: BBN6203BGNY30C(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 384-FBGA, FCCSPBGA
Supplier Device Package 384-FC/CSP (18x18)
Base Product Number BBN6203
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 90
Mfr Texas Instruments
Series TMS320C62x
Package Tray
Product Status Not For New Designs
Type Fixed Point
Interface McBSP
Clock Rate 300MHz
Non-Volatile Memory External
On-Chip RAM 896kB
Voltage - I/O 3.30V
Voltage - Core 1.50V
Operating Temperature 0°C ~ 90°C (TC)
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