Texas Instruments DRA829JMTGBALFR

DRA829JMTGBALFR


  • Manufacturer: Texas Instruments
  • CONEVO NO: DRA829JMTGBALFR
  • Package: 827-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
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Details

Tags

Parameters
Mfr Texas Instruments
Series -
Package Tape & Reel (TR)
Product Status Active
Architecture DSP, MCU, MPU
Core Processor ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Flash Size -
RAM Size 1.5MB
Peripherals DMA, PWM, WDT
Connectivity I²C, I³C, MCAN, MMC/SD/SDIO, SPI, UART, USB
Speed 2GHz, 1GHz, 1.35GHz, 1GHz
Primary Attributes -
Operating Temperature -40°C ~ 105°C (TJ)
Package / Case 827-BFBGA, FCBGA
Supplier Device Package 827-FCBGA (24x24)
Number of I/O 226
RoHS Status Not applicable
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN 5A992C
HTSUS 8542.31.0001
Other Names 296-DRA829JMTGBALFRTR
Standard Package 250
ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x System On Chip (SOC) IC - 2GHz, 1GHz, 1.35GHz, 1GHz 827-FCBGA (24x24)
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