Texas Instruments TDA3MVRBFABFRQ1

TDA3MVRBFABFRQ1


  • Manufacturer: Texas Instruments
  • CONEVO NO: TDA3MVRBFABFRQ1
  • Package: 367-BFBGA, FCBGA
  • Datasheet: -
  • Stock: In stock
  • Description: TDA3MVRBFABFRQ1(Kg)

Details

Tags

Parameters
Mfr Texas Instruments
Series -
Package Tape & Reel (TR)
Product Status Active
Architecture DSP, MPU
Core Processor ARM® Cortex®-M4, C66x
Flash Size -
RAM Size 512kB
Peripherals DMA, PWM, WDT
Connectivity CAN, MMC/SD/SDIO, McASP, I²C, SPI, UART, USB
Speed 212.8MHz, 745MHz
Primary Attributes -
Operating Temperature -40°C ~ 125°C (TJ)
Package / Case 367-BFBGA, FCBGA
Supplier Device Package 367-FCBGA (15x15)
Number of I/O 126
RoHS Status Not applicable
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN 3A991A1
HTSUS 8542.31.0001
Other Names 296-TDA3MVRBFABFRQ1TR
Standard Package 750
ARM® Cortex®-M4, C66x System On Chip (SOC) IC - 212.8MHz, 745MHz 367-FCBGA (15x15)
Contact Information
close