Texas Instruments TDA4VL21HGAALZRQ1

TDA4VL21HGAALZRQ1


  • Manufacturer: Texas Instruments
  • CONEVO NO: TDA4VL21HGAALZRQ1
  • Package: 770-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: TDA4VL21HGAALZRQ1(Kg)

Details

Tags

Parameters
Mfr Texas Instruments
Series Automotive, AEC-Q100
Package Tape & Reel (TR)
Product Status Active
Architecture DSP, MCU, MPU
Core Processor ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Flash Size -
RAM Size 1.5MB
Peripherals DMA, PWM, WDT
Connectivity MCAN, MMC/SD/SDIO, I²C, SPI, UART, USB
Speed 2GHz, 1GHz, 1GHz
Primary Attributes -
Operating Temperature -40°C ~ 125°C (TJ)
Package / Case 770-BFBGA, FCBGA
Supplier Device Package 770-FCBGA (23x23)
Number of I/O 155
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A992C
HTSUS 8542.31.0001
Standard Package 250
ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x System On Chip (SOC) IC Automotive, AEC-Q100 2GHz, 1GHz, 1GHz 770-FCBGA (23x23)
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