Texas Instruments TDA4VM88TGBALFR

TDA4VM88TGBALFR


  • Manufacturer: Texas Instruments
  • CONEVO NO: TDA4VM88TGBALFR
  • Package: 827-BFBGA, FCBGA
  • Datasheet: -
  • Stock: In stock
  • Description: TDA4VM88TGBALFR(Kg)

Details

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Parameters
Mfr Texas Instruments
Series Automotive, AEC-Q100
Package Tape & Reel (TR)
Product Status Active
Architecture DSP, MCU, MPU
Core Processor ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Flash Size -
RAM Size 1.5MB
Peripherals DMA, PWM, WDT
Connectivity MCAN, MMC/SDSD/IOI²C, SPI, UART, USB
Speed 2GHz, 1GHz, 1.35GHz, 1GHz
Primary Attributes -
Operating Temperature -40°C ~ 105°C (TJ)
Package / Case 827-BFBGA, FCBGA
Supplier Device Package 827-FCBGA (24x24)
Number of I/O 226
RoHS Status Not applicable
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN 5A992C
HTSUS 8542.31.0001
Standard Package 250
ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x System On Chip (SOC) IC Automotive, AEC-Q100 2GHz, 1GHz, 1.35GHz, 1GHz 827-FCBGA (24x24)
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