Trenz Electronic GmbH TEC0850-03-15EG1E
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| Parameters | |
|---|---|
| Mfr | Trenz Electronic GmbH |
| Series | Zynq® UltraScale+™ |
| Package | Bulk |
| Product Status | Obsolete |
| Module/Board Type | MCU, FPGA |
| Core Processor | Zynq UltraScale+ XCZU15EG-1FFVB1156E |
| Co-Processor | - |
| Speed | - |
| Flash Size | 128MB |
| RAM Size | 8GB |
| Connector Type | CompactPCI Serial Backplane |
| Size / Dimension | - |
| Operating Temperature | - |
| Base Product Number | TEC0850 |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| ECCN | 5A002A TRE |
| HTSUS | 8471.50.0150 |
| Other Names | 1686-1163 |
| Standard Package | 1 |
Zynq® UltraScale+™ Embedded Module Zynq UltraScale+ XCZU15EG-1FFVB1156E 8GB 128MB
