Winbond Electronics W25N512GVEIG

W25N512GVEIG


  • Manufacturer: Winbond Electronics
  • CONEVO NO: W25N512GVEIG
  • Package: 8-WDFN Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: W25N512GVEIG(Kg)

Details

Tags

Parameters
Mfr Winbond Electronics
Series SpiFlash®
Package Tube
Product Status Active
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND (SLC)
Memory Size 512Mbit
Memory Organization 64M x 8
Memory Interface SPI - Quad I/O
Clock Frequency 166 MHz
Write Cycle Time - Word, Page 700µs
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 8-WDFN Exposed Pad
Supplier Device Package 8-WSON (8x6)
Base Product Number W25N512
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B1A
HTSUS 8542.32.0071
Other Names 256-W25N512GVEIG
Standard Package 63
FLASH - NAND (SLC) Memory IC 512Mbit SPI - Quad I/O 166 MHz 8-WSON (8x6)
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