Winbond Electronics W25Q01JVSFIM

W25Q01JVSFIM


  • Manufacturer: Winbond Electronics
  • CONEVO NO: W25Q01JVSFIM
  • Package: 16-SOIC (0.295", 7.50mm Width)
  • Datasheet: PDF
  • Stock: In stock
  • Description: W25Q01JVSFIM(Kg)

Details

Tags

Parameters
Mfr Winbond Electronics
Series SpiFlash®
Package Tray
Product Status Active
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NOR
Memory Size 1Gbit
Memory Organization 128M x 8
Memory Interface SPI - Quad I/O
Clock Frequency 133 MHz
Write Cycle Time - Word, Page 3.5ms
Access Time 7.5 ns
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package 16-SOIC
Base Product Number W25Q01
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B1A
HTSUS 8542.32.0071
Other Names 256-W25Q01JVSFIM
Standard Package 44
FLASH - NOR Memory IC 1Gbit SPI - Quad I/O 133 MHz 7.5 ns 16-SOIC
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