Winbond Electronics W25Q01JVTBIM

W25Q01JVTBIM


  • Manufacturer: Winbond Electronics
  • CONEVO NO: W25Q01JVTBIM
  • Package: 24-TBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: W25Q01JVTBIM(Kg)

Details

Tags

Parameters
Mfr Winbond Electronics
Series SpiFlash®
Package Tray
Product Status Active
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NOR
Memory Size 1Gbit
Memory Organization 128M x 8
Memory Interface SPI - Quad I/O, QPI, DTR
Clock Frequency 133 MHz
Write Cycle Time - Word, Page 3.5ms
Access Time 7.5 ns
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 24-TBGA
Supplier Device Package 24-TFBGA (8x6)
Base Product Number W25Q01
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B1A
HTSUS 8542.32.0071
Other Names 256-W25Q01JVTBIM
Standard Package 480
FLASH - NOR Memory IC 1Gbit SPI - Quad I/O, QPI, DTR 133 MHz 7.5 ns 24-TFBGA (8x6)
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