Winbond Electronics W25Q16JWXHIM TR

W25Q16JWXHIM TR


  • Manufacturer: Winbond Electronics
  • CONEVO NO: W25Q16JWXHIM TR
  • Package: 8-XFDFN Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: W25Q16JWXHIM TR(Kg)

Details

Tags

Parameters
Mfr Winbond Electronics
Series SpiFlash®
Package Tape & Reel (TR)
Product Status Active
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NOR
Memory Size 16Mbit
Memory Organization 2M x 8
Memory Interface SPI - Quad I/O, QPI, DTR
Clock Frequency 133 MHz
Write Cycle Time - Word, Page 3ms
Access Time 6 ns
Voltage - Supply 1.65V ~ 1.95V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 8-XFDFN Exposed Pad
Supplier Device Package 8-XSON (2x3)
Base Product Number W25Q16
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0071
Other Names 256-W25Q16JWXHIMTR
Standard Package 4,000
FLASH - NOR Memory IC 16Mbit SPI - Quad I/O, QPI, DTR 133 MHz 6 ns 8-XSON (2x3)
Contact Information
close