Winbond Electronics W25Q32BVSFJG TR

W25Q32BVSFJG TR


  • Manufacturer: Winbond Electronics
  • CONEVO NO: W25Q32BVSFJG TR
  • Package: 16-SOIC (0.295", 7.50mm Width)
  • Datasheet: PDF
  • Stock: In stock
  • Description: W25Q32BVSFJG TR(Kg)

Details

Tags

Parameters
HTSUS 8542.32.0071
Other Names W25Q32BVSFJGTR
Standard Package 1,000
Mfr Winbond Electronics
Series SpiFlash®
Package Tape & Reel (TR)
Product Status Obsolete
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NOR
Memory Size 32Mbit
Memory Organization 4M x 8
Memory Interface SPI - Quad I/O
Clock Frequency 104 MHz
Write Cycle Time - Word, Page 50µs, 3ms
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
Package / Case 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package 16-SOIC
Base Product Number W25Q32
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B1A
FLASH - NOR Memory IC 32Mbit SPI - Quad I/O 104 MHz 16-SOIC
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