Winbond Electronics W25Q32FWXGAQ

W25Q32FWXGAQ


  • Manufacturer: Winbond Electronics
  • CONEVO NO: W25Q32FWXGAQ
  • Package: 8-XDFN Exposed Pad
  • Datasheet: -
  • Stock: In stock
  • Description: W25Q32FWXGAQ(Kg)

Details

Tags

Parameters
Package / Case 8-XDFN Exposed Pad
Supplier Device Package 8-XSON (4x4)
Base Product Number W25Q32
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN OBSOLETE
Other Names 256-W25Q32FWXGAQ
Standard Package 1
Mfr Winbond Electronics
Series SpiFlash®
Package Tube
Product Status Obsolete
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NOR
Memory Size 32Mbit
Memory Organization 4M x 8
Memory Interface SPI - Quad I/O, QPI
Clock Frequency 104 MHz
Write Cycle Time - Word, Page 60µs, 5ms
Access Time 6 ns
Voltage - Supply 1.65V ~ 1.95V
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
FLASH - NOR Memory IC 32Mbit SPI - Quad I/O, QPI 104 MHz 6 ns 8-XSON (4x4)
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