Winbond Electronics W25Q32JWBYIM TR

W25Q32JWBYIM TR


  • Manufacturer: Winbond Electronics
  • CONEVO NO: W25Q32JWBYIM TR
  • Package: 12-UFBGA, WLCSP
  • Datasheet: PDF
  • Stock: In stock
  • Description: W25Q32JWBYIM TR(Kg)

Details

Tags

Parameters
Mfr Winbond Electronics
Series SpiFlash®
Package Tape & Reel (TR)
Product Status Active
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NOR (SLC)
Memory Size 32Mbit
Memory Organization 4M x 8
Memory Interface SPI - Quad I/O
Clock Frequency 133 MHz
Write Cycle Time - Word, Page 5ms
Access Time 6 ns
Voltage - Supply 1.7V ~ 1.95V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 12-UFBGA, WLCSP
Supplier Device Package 12-WLCSP (2.31x2.03)
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN 3A991B1A
HTSUS 8542.32.0071
Other Names 256-W25Q32JWBYIMTR
Standard Package 4,500
FLASH - NOR (SLC) Memory IC 32Mbit SPI - Quad I/O 133 MHz 6 ns 12-WLCSP (2.31x2.03)
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