Winbond Electronics W25Q64JVSSIQ
| Parameters | |
|---|---|
| Series | SpiFlash® |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| RoHS Status | ROHS3 Compliant |
| Package / Case | 8-SOIC (0.209", 5.30mm Width) |
| Mfr | Winbond Electronics |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Technology | FLASH - NOR |
| Supplier Device Package | 8-SOIC |
| Memory Size | 64Mbit |
| Memory Type | Non-Volatile |
| Voltage - Supply | 2.7V ~ 3.6V |
| Clock Frequency | 133 MHz |
| Memory Organization | 8M x 8 |
| Memory Format | FLASH |
| Memory Interface | SPI - Quad I/O |
| Write Cycle Time - Word, Page | 3ms |
| Package | Tube |
| Product Status | Active |
| Base Product Number | W25Q64 |
| REACH Status | REACH Unaffected |
| Standard Package | 90 |
| ECCN | 3A991B1A |
| HTSUS | 8542.32.0071 |
Winbond Electronics W25Q64JVSSIQ is a 64M-bit Serial Flash Memory IC with a unified 4KB sector and Dual/Quad SPI interface. The W25Q64JVSSIQ provides 64Mb (8M x 8bit) of storage capacity, supports SPI interface, and has a maximum clock rate of 133MHz, which is suitable for applications requiring high-speed data communication. The device is packaged in a variety of ways, These include SOIC8 208mil, SOIC16 300mil, WSON6X5mm, WSON8 8X6mm, XSON8 4x4x0.45mm, TFBGA24 6X8mm (4x6 Ball Array), and 24-ball TFBGA 8x6-mm (5x5 Ball Array). The operating voltage range is 2.7V-3.6V, and the operating temperature range is from -40 ° C to 85 ° C, with some versions supporting a wider temperature range, such as -40 ° C to 105 ° C or -40 ° C to 125 ° C. It also has unique features, For example, 4 I/O Fixed, UID & OTP Feature, Volatile & Non-Volatile SR, Programmable Output Driver Strength, and Individual Block/Sector Write Protection to suit different programming and security needs.
W25Q64JVSSIQ Features:
· Storage capacity: 64Mb
· Interface type: SPI/Quad SPI
· Max frequency: 133MHz (266/532MHz for Dual/Quad-SPI)
· Working voltage: 2.7V ~ 3.6V
· Operating temperature range: -40℃ ~ 85℃ (some versions can support -40℃ ~ 105℃ or -40℃ ~ 125℃)
· Access time: up to 6ns
· Erase programming cycles: more than 100,000 times
Winbond' W25Q64JVSSIQ Application:
The W25Q64JVSSIQ is suitable for a variety of application scenarios, including but not limited to mobile devices, handheld devices, automotive electronics, industrial control, security systems, iot devices, and more. Due to its high-speed SPI interface and flexible packaging options, it is particularly suitable for applications requiring fast data access and high reliability. In addition, its high temperature operating range also makes it suitable for industrial applications in some extreme environments.
