Winbond Electronics W25Q64JVTCIM

W25Q64JVTCIM


  • Manufacturer: Winbond Electronics
  • CONEVO NO: W25Q64JVTCIM
  • Package: 24-TBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: W25Q64JVTCIM(Kg)

Details

Tags

Parameters
Clock Frequency 133 MHz
Write Cycle Time - Word, Page 3ms
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 24-TBGA
Supplier Device Package 24-TFBGA (8x6)
Base Product Number W25Q64
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B1A
HTSUS 8542.32.0071
Standard Package 480
Mfr Winbond Electronics
Series SpiFlash®
Package Tube
Product Status Active
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NOR
Memory Size 64Mbit
Memory Organization 8M x 8
Memory Interface SPI - Quad I/O
FLASH - NOR Memory IC 64Mbit SPI - Quad I/O 133 MHz 24-TFBGA (8x6)
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