Winbond Electronics W25Q64JVZPIM

W25Q64JVZPIM


  • Manufacturer: Winbond Electronics
  • CONEVO NO: W25Q64JVZPIM
  • Package: 8-WDFN Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: W25Q64JVZPIM(Kg)

Details

Tags

Parameters
Mfr Winbond Electronics
Series SpiFlash®
Package Tray
Product Status Active
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NOR
Memory Size 64Mbit
Memory Organization 8M x 8
Memory Interface SPI - Quad I/O, QPI, DTR
Clock Frequency 133 MHz
Write Cycle Time - Word, Page 3ms
Access Time 6 ns
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 8-WDFN Exposed Pad
Supplier Device Package 8-WSON (6x5)
Base Product Number W25Q64
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0071
Other Names 256-W25Q64JVZPIM
Standard Package 570
FLASH - NOR Memory IC 64Mbit SPI - Quad I/O, QPI, DTR 133 MHz 6 ns 8-WSON (6x5)
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