Winbond Electronics W29N01HWSINA

W29N01HWSINA


  • Manufacturer: Winbond Electronics
  • CONEVO NO: W29N01HWSINA
  • Package: 48-TFSOP (0.724", 18.40mm Width)
  • Datasheet: PDF
  • Stock: In stock
  • Description: W29N01HWSINA(Kg)

Details

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Parameters
ECCN 3A991B1A
HTSUS 8542.32.0071
Other Names 256-W29N01HWSINA
Standard Package 96
Mfr Winbond Electronics
Series -
Package Tray
Product Status Active
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND (SLC)
Memory Size 1Gbit
Memory Organization 128M x 8
Memory Interface Parallel
Write Cycle Time - Word, Page 25ns
Access Time 25 ns
Voltage - Supply 1.7V ~ 1.95V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 48-TFSOP (0.724", 18.40mm Width)
Supplier Device Package 48-TSOP
Base Product Number W29N01
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
FLASH - NAND (SLC) Memory IC 1Gbit Parallel 25 ns 48-TSOP
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