Winbond Electronics W29N08GZSIBA TR

W29N08GZSIBA TR


  • Manufacturer: Winbond Electronics
  • CONEVO NO: W29N08GZSIBA TR
  • Package: 48-TFSOP (0.724", 18.40mm Width)
  • Datasheet: PDF
  • Stock: In stock
  • Description: W29N08GZSIBA TR(Kg)
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Parameters
Supplier Device Package 48-TSOP
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN 3A991B1A
HTSUS 8542.32.0071
Other Names 256-W29N08GZSIBATR
Standard Package 1,500
Mfr Winbond Electronics
Series -
Package Tape & Reel (TR)
Product Status Active
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND (SLC)
Memory Size 8Gbit
Memory Organization 1G x 8
Memory Interface ONFI
Write Cycle Time - Word, Page 35ns, 700µs
Access Time 25 ns
Voltage - Supply 1.7V ~ 1.95V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 48-TFSOP (0.724", 18.40mm Width)
FLASH - NAND (SLC) Memory IC 8Gbit ONFI 25 ns 48-TSOP
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