Winbond Electronics W632GG6KB-18

W632GG6KB-18


  • Manufacturer: Winbond Electronics
  • CONEVO NO: W632GG6KB-18
  • Package: 96-TFBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: W632GG6KB-18(Kg)

Details

Tags

Parameters
Mfr Winbond Electronics
Series -
Package Tray
Product Status Discontinued at Digi-Key
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - DDR3
Memory Size 2Gbit
Memory Organization 128M x 16
Memory Interface Parallel
Clock Frequency 533 MHz
Write Cycle Time - Word, Page -
Access Time 20 ns
Voltage - Supply 1.425V ~ 1.575V
Operating Temperature 0°C ~ 95°C (TC)
Mounting Type Surface Mount
Package / Case 96-TFBGA
Supplier Device Package 96-WBGA (9x13)
Base Product Number W632GG6
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0036
Standard Package 242
SDRAM - DDR3 Memory IC 2Gbit Parallel 533 MHz 20 ns 96-WBGA (9x13)
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