Winbond Electronics W632GU6KB12J

W632GU6KB12J


  • Manufacturer: Winbond Electronics
  • CONEVO NO: W632GU6KB12J
  • Package: 96-TFBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: W632GU6KB12J(Kg)

Details

Tags

Parameters
Mfr Winbond Electronics
Series -
Package Tray
Product Status Discontinued at Digi-Key
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - DDR3
Memory Size 2Gbit
Memory Organization 128M x 16
Memory Interface Parallel
Clock Frequency 800 MHz
Write Cycle Time - Word, Page -
Access Time 20 ns
Voltage - Supply 1.283V ~ 1.45V
Operating Temperature -40°C ~ 105°C (TC)
Mounting Type Surface Mount
Package / Case 96-TFBGA
Supplier Device Package 96-WBGA (9x13)
Base Product Number W632GU6
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0036
Standard Package 190
SDRAM - DDR3 Memory IC 2Gbit Parallel 800 MHz 20 ns 96-WBGA (9x13)
Contact Information
close