Winbond Electronics W63AH6NBVADI

W63AH6NBVADI


  • Manufacturer: Winbond Electronics
  • CONEVO NO: W63AH6NBVADI
  • Package: 178-VFBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: W63AH6NBVADI(Kg)

Details

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Parameters
Mfr Winbond Electronics
Series -
Package Tray
Product Status Active
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPDDR3
Memory Size 1Gbit
Memory Organization 64M x 16
Memory Interface HSUL_12
Clock Frequency 1.066 GHz
Write Cycle Time - Word, Page 15ns
Access Time 5.5 ns
Voltage - Supply 1.14V ~ 1.3V, 1.7V ~ 1.95V
Operating Temperature -40°C ~ 85°C (TC)
Mounting Type Surface Mount
Package / Case 178-VFBGA
Supplier Device Package 178-VFBGA (11x11.5)
Base Product Number W63AH6
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0032
Other Names 256-W63AH6NBVADI
Standard Package 189
SDRAM - Mobile LPDDR3 Memory IC 1Gbit HSUL_12 1.066 GHz 5.5 ns 178-VFBGA (11x11.5)
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