Winbond Electronics W66CM2NQUAFJ

W66CM2NQUAFJ


  • Manufacturer: Winbond Electronics
  • CONEVO NO: W66CM2NQUAFJ
  • Package: 200-WFBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: W66CM2NQUAFJ(Kg)

Details

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Parameters
Mfr Winbond Electronics
Series -
Package Tray
Product Status Not For New Designs
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPDDR4X
Memory Size 4Gbit
Memory Organization 128M x 32
Memory Interface LVSTL_11
Clock Frequency 1.6 GHz
Write Cycle Time - Word, Page 18ns
Access Time 3.5 ns
Voltage - Supply 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature -40°C ~ 105°C (TC)
Mounting Type Surface Mount
Package / Case 200-WFBGA
Supplier Device Package 200-WFBGA (10x14.5)
Base Product Number W66CM2
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0036
Other Names 256-W66CM2NQUAFJ
Standard Package 144
SDRAM - Mobile LPDDR4X Memory IC 4Gbit LVSTL_11 1.6 GHz 3.5 ns 200-WFBGA (10x14.5)
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