Winbond Electronics W66CP2NQUAFJ

W66CP2NQUAFJ


  • Manufacturer: Winbond Electronics
  • CONEVO NO: W66CP2NQUAFJ
  • Package: 200-WFBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: W66CP2NQUAFJ(Kg)

Details

Tags

Parameters
Mfr Winbond Electronics
Series -
Package Tray
Product Status Active
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPDDR4
Memory Size 4Gbit
Memory Organization 128M x 32
Memory Interface LVSTL_11
Clock Frequency 2.133 GHz
Write Cycle Time - Word, Page -
Access Time 3.5 ns
Voltage - Supply 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature -40°C ~ 105°C (TC)
Mounting Type Surface Mount
Package / Case 200-WFBGA
Supplier Device Package 200-WFBGA (10x14.5)
Base Product Number W66CP2
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0036
Other Names 256-W66CP2NQUAFJ
Standard Package 144
SDRAM - Mobile LPDDR4 Memory IC 4Gbit LVSTL_11 2.133 GHz 3.5 ns 200-WFBGA (10x14.5)
Contact Information
close