Winbond Electronics W979H6KBQX2I

W979H6KBQX2I


  • Manufacturer: Winbond Electronics
  • CONEVO NO: W979H6KBQX2I
  • Package: 168-WFBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: W979H6KBQX2I(Kg)

Details

Tags

Parameters
Mfr Winbond Electronics
Series -
Package Tray
Product Status Active
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPDDR2
Memory Size 512Mbit
Memory Organization 32M x 16
Memory Interface Parallel
Clock Frequency 400 MHz
Write Cycle Time - Word, Page 15ns
Voltage - Supply 1.14V ~ 1.95V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 168-WFBGA
Supplier Device Package 168-WFBGA (12x12)
Base Product Number W979H6
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0028
Standard Package 168
SDRAM - Mobile LPDDR2 Memory IC 512Mbit Parallel 400 MHz 168-WFBGA (12x12)
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