XMOS XEF216-256-FB236-C20

XEF216-256-FB236-C20


  • Manufacturer: XMOS
  • CONEVO NO: XEF216-256-FB236-C20
  • Package: 236-LFBGA
  • Datasheet: PDF
  • Stock: In stock
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Details

Tags

Parameters
Mfr XMOS
Series XEF
Package Tray
Product Status Discontinued at Digi-Key
Core Processor XCore
Core Size 32-Bit 16-Core
Speed 2000MIPS
Connectivity RGMII, USB
Peripherals -
Number of I/O 73
Program Memory Size 2MB (2M x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 256K x 8
Voltage - Supply (Vcc/Vdd) 0.95V ~ 3.6V
Data Converters -
Oscillator Type External
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Package / Case 236-LFBGA
Supplier Device Package 236-FBGA (10x10)
Base Product Number XEF216
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A002A1
HTSUS 8542.31.0001
Standard Package 168
XCore XEF Microcontroller IC 32-Bit 16-Core 2000MIPS 2MB (2M x 8) FLASH 236-FBGA (10x10)
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