XMOS XEF232-512-FB374-C40

XEF232-512-FB374-C40


  • Manufacturer: XMOS
  • CONEVO NO: XEF232-512-FB374-C40
  • Package: 374-LFBGA
  • Datasheet: -
  • Stock: In stock
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Details

Tags

Parameters
Mfr XMOS
Series XEF
Package Tray
Product Status Discontinued at Digi-Key
Core Processor XCore
Core Size 32-Bit 32-Core
Speed 4000MIPS
Connectivity RGMII, USB
Peripherals -
Number of I/O 176
Program Memory Size 2MB (2M x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 512K x 8
Voltage - Supply (Vcc/Vdd) 0.95V ~ 3.6V
Data Converters -
Oscillator Type External
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Package / Case 374-LFBGA
Supplier Device Package 374-FBGA (18x18)
Base Product Number XEF232
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A002A1
HTSUS 8542.31.0001
Other Names 880-1108
Standard Package 84
XCore XEF Microcontroller IC 32-Bit 32-Core 4000MIPS 2MB (2M x 8) FLASH 374-FBGA (18x18)
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