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Micron HBM Capacity Sprint: 100,000 Wafers per Month
Micron Technology is vigorously advancing its HBM capacity expansion, planning to increase monthly capacity from about 40,000 to 50,000 wafers last year to about 100,000 wafers by the end of 2026, achieving more than a doubling of capacity.According to South Korean media outlet ETNews, Micron plans ...
Thursday 10 September, 2026
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Qualcomm & Amazon Partner on AI Inference Chips and 1.6T Optical Connectivity
On September 8, 2026, Qualcomm and Amazon announced a major AI infrastructure collaboration spanning multiple product generations. The two companies will jointly develop multi‑generation custom chips for large‑scale AI data centers, with a focus on AI inference scenarios. At the same time, they are ...
Wednesday 09 September, 2026
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Analog Chip Price Hikes Persist: TI Implements Third Price Adjustment
On September 1, Texas Instruments (TI), the global leader in analog chips, once again issued a price adjustment notice to its customers, announcing a new round of price increases across multiple analog and power management product families. This marks TI's third price adjustment since the beginn...
Tuesday 08 September, 2026
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